Journal of The Japan Institute of Electronics Packaging

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Preface

Role of the of the Japan Institute of Electronics Packaging

Eiji Higurashi

Article type: Preface
2025 Volume 28 Issue 4 Pages P4
Published: July 01, 2025
Released on J-STAGE: July 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.P4

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2025 JIEP Award

2025 JIEP Award

2025 Volume 28 Issue 4 Pages 279-291
Published: July 01, 2025
Released on J-STAGE: July 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.279

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Special Articles / Latest Trends in Car Electronics for Sustainable Society

Introduction to the Special Edition

Yuichi Takeda

Article type: Special Articles
2025 Volume 28 Issue 4 Pages 292
Published: July 01, 2025
Released on J-STAGE: July 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.292

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Trend of Thermal Management Technology for Electric Vehicles

Masanari Numata

Article type: Special Articles
2025 Volume 28 Issue 4 Pages 293-298
Published: July 01, 2025
Released on J-STAGE: July 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.293

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Technical Trend of Power Electronics Systems and Power Semiconductor Device Packaging for Automotive Applications

Masayoshi Yamamoto

Article type: Special Articles
2025 Volume 28 Issue 4 Pages 299-301
Published: July 01, 2025
Released on J-STAGE: July 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.299

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Global Competitiveness of Automotive Batteries and Japan’s Policy

Noboru Sato

Article type: Special Articles
2025 Volume 28 Issue 4 Pages 302-310
Published: July 01, 2025
Released on J-STAGE: July 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.302

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About Our Automotive Power Modules That Contribute to the Miniaturization and Higher Performance of Inverters

Arata Iizuka, Naohiro Ogushi

Article type: Special Articles
2025 Volume 28 Issue 4 Pages 311-318
Published: July 01, 2025
Released on J-STAGE: July 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.311

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Automotive PCB Technology Development for Autonomous Driving

Mitsuaki Toda, Kouichi Kamiyama

Article type: Special Articles
2025 Volume 28 Issue 4 Pages 319-327
Published: July 01, 2025
Released on J-STAGE: July 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.319

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Application of Epoxy Molding Compound to Mobility and Their Contribution to the Environment

Shinichiro Kobayashi

Article type: Special Articles
2025 Volume 28 Issue 4 Pages 328-332
Published: July 01, 2025
Released on J-STAGE: July 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.328

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Tutorial Series-Joining and Adhesion Technology Course / (5)

Fundamentals of Adhesion Technology and The Application to Electronics

Chiaki Sato

Article type: Tutorial Series
2025 Volume 28 Issue 4 Pages 333-336
Published: July 01, 2025
Released on J-STAGE: July 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.333

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Report

Okada Laboratory, Department of Electrical and Electronics, School of Engineering, Institute of Science Tokyo

Kenichi Okada

Article type: Report
2025 Volume 28 Issue 4 Pages 337
Published: July 01, 2025
Released on J-STAGE: July 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.337

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Report

2025 International Conference on Electronics Packaging joined with iMAPS All Asia Conference

Article type: Report
2025 Volume 28 Issue 4 Pages 368-378
Published: July 01, 2025
Released on J-STAGE: July 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.368

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Announcement, Contents, etc.

JIEP Mission Fellow

Article type: Announcement, Contents, etc.
2025 Volume 28 Issue 4 Pages 338
Published: July 01, 2025
Released on J-STAGE: July 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.338

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The 14th Regular Meeting

Article type: Announcement, Contents, etc.
2025 Volume 28 Issue 4 Pages 339-367
Published: July 01, 2025
Released on J-STAGE: July 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.339

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[title in Japanese]

Article type: Announcement, Contents, etc.
2025 Volume 28 Issue 4 Pages 379-381
Published: July 01, 2025
Released on J-STAGE: July 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.379

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News

Article type: Announcement, Contents, etc.
2025 Volume 28 Issue 4 Pages 382-384
Published: July 01, 2025
Released on J-STAGE: July 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.382

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Announcement

Article type: Announcement, Contents, etc.
2025 Volume 28 Issue 4 Pages A41-
Published: July 01, 2025
Released on J-STAGE: July 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.A41

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Contents

Article type: Announcement, Contents, etc.
2025 Volume 28 Issue 4 Pages C41
Published: July 01, 2025
Released on J-STAGE: July 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.C41

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Contents (in English)

Article type: Announcement, Contents, etc.
2025 Volume 28 Issue 4 Pages C42
Published: July 01, 2025
Released on J-STAGE: July 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.C42

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Instruction for Authors

Article type: Announcement, Contents, etc.
2025 Volume 28 Issue 4 Pages I41-
Published: July 01, 2025
Released on J-STAGE: July 01, 2025

DOIhttps://doi.org/10.5104/jiep.28.I41

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