Journal of The Japan Institute of Electronics Packaging

Journal of The Japan Institute of Electronics Packaging

Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677

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Volume 19, Issue 5

Displaying 1-21 of 21 articles from this issue

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Preface

Preface-A Reformation Against “The Fourth Wave”

Yoichi Shiraishi

2016 Volume 19 Issue 5 Pages P5
Published: 2016
Released on J-STAGE: November 01, 2016

DOIhttps://doi.org/10.5104/jiep.19.P5

JOURNAL FREE ACCESS

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Special Articles / Evolution of In-Vehicle Control System & Direction of Electronics Packaging Innovation

(Title page)

2016 Volume 19 Issue 5 Pages 287
Published: 2016
Released on J-STAGE: November 01, 2016

DOIhttps://doi.org/10.5104/jiep.19.287

JOURNAL FREE ACCESS

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Introduction to the Special Edition

Toshihiro Miyake

2016 Volume 19 Issue 5 Pages 288
Published: 2016
Released on J-STAGE: November 01, 2016

DOIhttps://doi.org/10.5104/jiep.19.288

JOURNAL FREE ACCESS

Download PDF (855K)

Keynote Article

Historical Overview of Automotive Electronics and Future Trends

Mitsuharu Kato

2016 Volume 19 Issue 5 Pages 289-300
Published: 2016
Released on J-STAGE: November 01, 2016

DOIhttps://doi.org/10.5104/jiep.19.289

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Printed Wiring Board / Electronic Component

Technology Trends of Automotive PWB

Yuji Kobayashi

2016 Volume 19 Issue 5 Pages 301-304
Published: 2016
Released on J-STAGE: November 01, 2016

DOIhttps://doi.org/10.5104/jiep.19.301

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Thermal Conductivity Evaluation Result of Automotive Printed Circuit Board

Mitsuaki Toda, Masahiro Ozeki, Kazuo Shishime

2016 Volume 19 Issue 5 Pages 305-309
Published: 2016
Released on J-STAGE: November 01, 2016

DOIhttps://doi.org/10.5104/jiep.19.305

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Approach from Passive Components for Challenges in Car Electronics

Hideki Akahane

2016 Volume 19 Issue 5 Pages 310-314
Published: 2016
Released on J-STAGE: November 01, 2016

DOIhttps://doi.org/10.5104/jiep.19.310

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Trend of Multi-Layer Ceramic Capacitor for Automotive

Yoshio Takeuchi, Satoshi Ishitobi

2016 Volume 19 Issue 5 Pages 315-320
Published: 2016
Released on J-STAGE: November 01, 2016

DOIhttps://doi.org/10.5104/jiep.19.315

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Mechatronics / Power Electronics

Next Generation High Power Density Electric Components Technologies

Akihiro Namba, Kinya Nakatsu, Atsuo Nishihara, Masami Ohnishi

2016 Volume 19 Issue 5 Pages 321-324
Published: 2016
Released on J-STAGE: November 01, 2016

DOIhttps://doi.org/10.5104/jiep.19.321

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An Approach to Floating Connector on Vibration

Tomisaburo Yamaguchi, Natsuhiro Mita

2016 Volume 19 Issue 5 Pages 325-327
Published: 2016
Released on J-STAGE: November 01, 2016

DOIhttps://doi.org/10.5104/jiep.19.325

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Current Issues and Future Trends of Automotive Power Device

Arihiro Kamiya

2016 Volume 19 Issue 5 Pages 328-334
Published: 2016
Released on J-STAGE: November 01, 2016

DOIhttps://doi.org/10.5104/jiep.19.328

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A Study of Novel Heatsink for Power Semiconductor Modules Using High Thermal Conductive Graphite

Yasushi Yamada, Masashi Yanase, Daiki Miura, Katsuhiro Chikuba

2016 Volume 19 Issue 5 Pages 335-339
Published: 2016
Released on J-STAGE: November 01, 2016

DOIhttps://doi.org/10.5104/jiep.19.335

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Verification for Power Device of Thermal Resistance θ_JC

Takuya Shinoda

2016 Volume 19 Issue 5 Pages 340-343
Published: 2016
Released on J-STAGE: November 01, 2016

DOIhttps://doi.org/10.5104/jiep.19.340

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Electromagnetic Field Interface / Design CAE

Electromagnetic Field Interfaces for Vehicle System— Antennas, Wireless Power Transfer, and Human Body Communication in Motor Vehicle System

Fukuro Koshiji

2016 Volume 19 Issue 5 Pages 344-350
Published: 2016
Released on J-STAGE: November 01, 2016

DOIhttps://doi.org/10.5104/jiep.19.344

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Advanced Automotive Electronics Using Electromagnetic Field

Yoshiyuki Hattori

2016 Volume 19 Issue 5 Pages 351-356
Published: 2016
Released on J-STAGE: November 01, 2016

DOIhttps://doi.org/10.5104/jiep.19.351

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An Application of Near-Field Intrabody Communication to the Vehicle

Yasuo Kato

2016 Volume 19 Issue 5 Pages 357-360
Published: 2016
Released on J-STAGE: November 01, 2016

DOIhttps://doi.org/10.5104/jiep.19.357

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High-Speed Simulation and Design Optimization for Mechatronics Systems

Hideki Asai

2016 Volume 19 Issue 5 Pages 361-364
Published: 2016
Released on J-STAGE: November 01, 2016

DOIhttps://doi.org/10.5104/jiep.19.361

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Announcement, Contents, etc.

News

2016 Volume 19 Issue 5 Pages 365-366
Published: 2016
Released on J-STAGE: November 01, 2016

DOIhttps://doi.org/10.5104/jiep.19.365

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Announcement

2016 Volume 19 Issue 5 Pages A51-
Published: 2016
Released on J-STAGE: November 01, 2016

DOIhttps://doi.org/10.5104/jiep.19.A51

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Contents

2016 Volume 19 Issue 5 Pages C51
Published: 2016
Released on J-STAGE: November 01, 2016

DOIhttps://doi.org/10.5104/jiep.19.C51

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Contents (in English)

2016 Volume 19 Issue 5 Pages C52
Published: 2016
Released on J-STAGE: November 01, 2016

DOIhttps://doi.org/10.5104/jiep.19.C52

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Download PDF (829K)

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