In this paper, we propose the method that PZT thin layer, which is formed on a Si substrate, can be transferred to polydimethylsiloxane (PDMS) without additional chemical contamination. In consideration of embedding in the substrate more easily, sandwich structures of PZT between two metal layers are used as thin-film capacitor. To embed PZT in the PDMS substrate by dry process, 3-mercaptopropyltrimethoxysilane (MPTMS) is used in this process as the molecular glue. MPTMS was coated on the upper electrode, gold, as an adhesive layer between gold and PDMS. As a result, the sample with thickness of 300 nm that was treated with MPTMS is embedded in PDMS.