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Masakatsu Maeda, Satoko Kitamori, Yasuo Takahashi
Session ID: 448
Published: 2006
Released on J-STAGE: November 09, 2006
CONFERENCE PROCEEDINGS
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Thick aluminum wires were bonded to Al-Si pads formed on silicon substrates by ultrasonic wedge microbonding. Direct metal-metal adhesion is formed in the central part of the bond interface, while amorphous alumina prevented the adhesion in the periphery.
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Masatoshi NAKAMURA, Kiyokazu YASUDA, Michiya MATSUSHIMA, Kozo FUJIMOTO
Session ID: 449
Published: 2006
Released on J-STAGE: November 09, 2006
CONFERENCE PROCEEDINGS
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The inter-chip optical communication system attracts the attention because of transmission speed more than 10GHz. In this paper, we suggest mirror-less bended graded-index waveguide structure and direct writing into photosensitive resin by use of two-photon absorption phenomenon.
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Minoru EGUSA, Michiya MATSUSHIMA, Kyohei FUKUDA, Masaki NAKAURA, Kiyok ...
Session ID: 450
Published: 2006
Released on J-STAGE: November 09, 2006
CONFERENCE PROCEEDINGS
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We investigated the effect of chip heating on the thermal cycle load on BGA solder joints with FEM analysis and thermal cycle test. We showed the increase of inelastic strain caused by the chip heating and the necessity of considering chip heating in the reliability evaluation.
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Hiroshi Nishikawa, Akira Komatsu, Tadashi Takemoto
Session ID: 451
Published: 2006
Released on J-STAGE: November 09, 2006
CONFERENCE PROCEEDINGS
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Hiroshi Nishikawa, Songai Kang, Tadashi Takemoto
Session ID: 452
Published: 2006
Released on J-STAGE: November 09, 2006
CONFERENCE PROCEEDINGS
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Fang jie CHENG, Hiroshi NISHIKAWA, Tadashi TAKEMOTO
Session ID: 453
Published: 2006
Released on J-STAGE: November 09, 2006
CONFERENCE PROCEEDINGS
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Any addition of Co and Ni should form a third precipitates in the type of CoSn2 or (Cu,Ni)6Sn5. The strength is reduced slightly but the elongation is increased obviously after aging treatment for all specimens.
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Miki Kondo, Yusuke Akada, Akio Hirose, Kojiro Kobayashi
Session ID: 454
Published: 2006
Released on J-STAGE: November 09, 2006
CONFERENCE PROCEEDINGS
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Development of low melting points solders that can be used for assembly of low heat-resistant devises at a reflow peak temperature of no higher than 373K is needed. In the present study, the properties of Bi-In-Sn ternary alloys for low melting point solders were evaluated.
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FENG GAO, Hiroshi Nishikawa, Tadashi Takemoto
Session ID: 455
Published: 2006
Released on J-STAGE: November 09, 2006
CONFERENCE PROCEEDINGS
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The Ag3Sn morphology was explored during soldering between lead-free solder ball and the common substrates. The minor additives CoNi was doped into Sn3.5Ag solder to assess the effects on the Ag3Sn topology. After aging, the morphology evolution of Ag3Sn was also studied.
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MAKOTO MIYAZAKI, SHIGEYUKI OGATA, Akio Yoshida, Hideo Sasagawa, Hiroyu ...
Session ID: 456
Published: 2006
Released on J-STAGE: November 09, 2006
CONFERENCE PROCEEDINGS
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Gas corrosion properties for Sn-Ag-In-Bi solder were investigated. Gas corrosion properties for In alloys have not been investigated, because In was not used as solder. In this paper, the results of observation and shear tests after gas corrosion tests are reported.
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Takahisa Yamazaki, Akio Suzumura, Toshi-Taka Ikeshoji, Osamu Shimizu
Session ID: 457
Published: 2006
Released on J-STAGE: November 09, 2006
CONFERENCE PROCEEDINGS
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For precise polishing, joining a diamond to a polishing jig by soldering using Sn-In-Al-Si-V was tried and the reaction products at the soldered interface were investigated to achieve joint strength by an X-ray diffractometer.
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Report 3 - Evaluation of Mechanical Properties of Weld Metall in Full-scale Beam-column Joints
TADAHISA TSUYAMA, TOSHIAKI FUJITA, MAKOTO YUDA, YUJI HASHIBA, TOSHIEI ...
Session ID: 458
Published: 2006
Released on J-STAGE: November 09, 2006
CONFERENCE PROCEEDINGS
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We investigated relations of 800-500 degrees cooling time(t8/5) of YGW18 welding metal and strength/toughness using test specimen of beam-column joints. T8/5 of beam-column joints is less than it of miniatuar test specimens and charpy absorbed energy showed more than 70J.
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Report 4 -Metallurgical Factors for Toughness of Weld Metal in Full-scale Beam-column Joints
YUJI HASHIBA, TOSHIEI HASEGAWA, YUZURU YOSHIDA, TADAHISA TSUYAMA, TOSH ...
Session ID: 459
Published: 2006
Released on J-STAGE: November 09, 2006
CONFERENCE PROCEEDINGS
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Relationship of microstructure, hardness and Charpy absorbed energy of multi-layered weld metal in full-scale beam-column joints was investigated. It was presumed that decrease of ductility caused decrease of Charpy absorbed energy of weld metal.
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Hiroshi Matsumura, Shigeto Takada, Keiji Okayama
Session ID: 460
Published: 2006
Released on J-STAGE: November 09, 2006
CONFERENCE PROCEEDINGS
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In the Joint of Steel Structure, the thickness of the diaphragm and the beam flange is different. So, even if the flange thickness is the same, the welding condition is different. In this presentation, it introduces the method of constructing the robot welding that solves these.
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