SPring-8/SACLA Research Report
Online ISSN : 2187-6886
Section B
In-situ Residual Stress Analysis of Semiconductor Packaging Substrate Resins in Thermosetting Process for Investigation of their Optimum Manufacturing Process
Takeshi Kakara, Dai Nagashima, Atsushi Izumi
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Keywords: 2017A1813, BL19B2
JOURNAL OPEN ACCESS

2018 Volume 6 Issue 2 Pages 352-355

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[in Japanese]
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