SPring-8/SACLA Research Report
Online ISSN : 2187-6886
Section B
Residual Stress Analysis in Encapsulation Resins for Semiconductor Packaging with Thermal History
Midori Wakabayashi, Hiroshi Nakaido, Yasuyuki Shudo, Atsushi Izumi
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Keywords: 2014A1767, BL19B2
JOURNAL OPEN ACCESS

2015 Volume 3 Issue 2 Pages 589-591

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[in Japanese]
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