Journal of The Surface Finishing Society of Japan
Online ISSN : 1884-3409
Print ISSN : 0915-1869
ISSN-L : 0915-1869
Autocatalytic Electroless Silver Deposition Using 2-Aminoethanethiol as Reducing Agent
Hidemi NAWAFUNEKeiko SHIROGUCHIMasato TANIKUBOShozo MIZUMOTOYasuhito KOHASHITakao TAKEUCHI
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1999 Volume 50 Issue 10 Pages 928-932

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Abstract
The significance of the electroless silver plating bath using ethanethiol derivatives as reducing and complex agents lies in it being noncyanide, having near by neutral pH, and providing good storage stability. This is achieved by plating in a composition that is neither immersion for coating electroless nickel substrates nor autocatalytic.
Anodic polarization curves of 2-aminoethanethiol (cysteamine) and N-acetyl-L-cysteine in a basic electrolyte showed that 2-aminoethanethiol acts as a reducing agent and that N-acetyl-L-cysteine is not easily oxidized on silver electrodes. Experiments in polarization confirmed the mixed potential theory including local potentialcurrent relationships for silver deposition. Based on information available on oxidation of the reducing agent, we propose the following partial anodic and cathodic reactions:
Anodic partial reaction
2HSCH2CH2NH2→H2NCH2CH2SSCH2CH2NH2+2H++2e-
(Cysteamine) (Cystamine)
Cathodic partial reaction
Ag++e-→Ag
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