Electroless solder plating by the displacement reaction has been investigated. The addition of free borofluoride and hydroxylamine both improved the stability and extended the life of the plating bath The plating bath reaction was initiated 10s after immersion of the copper substrate into the bath Deposition morphology after 1min of reaction was similar to the final equilibrium stage of the deposit. Wettability was decreased due to diffusion of copper at film thickness of around 0.5μm, but (film thickness of 4μm or more) wettability was excellent with no decrease observed