Journal of The Surface Finishing Society of Japan
Online ISSN : 1884-3409
Print ISSN : 0915-1869
ISSN-L : 0915-1869
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Electroless Ni/Pd/Au Plating for Semiconductor Package Substrate
Kiyoshi HASEGAWA, Akio TAKAHASHI, Takaaki NOUDOU, Akishi NAKASO
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Keywords: Electroless Ni/Pd/Au, BGA Package Substrate, Wire Bonding Reliability, Solder Joint Reliability
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2006 Volume 57 Issue 9 Pages 616

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Journal of the Metal Finishing Society of Japan

Genba Panfuretto

Jitsumu Hyomen Gijutsu

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