Preprints of the National Meeting of JWS
Preprints of the National Meeting of JWS
Session ID : 440
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Host: Japan Welding Society

Oral session
Effect of Porous Cu Interlayer on Microstructure and Mechanical Properties of Pb-Free Solder Joint
*Hani Jamadon Nashrah, Yukio Miyashita, Yusof Farazila, Tadashi Ariga, Hamdi Mohd
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Keywords: lead-free solder, solder joint, porous Cu interlayer, bonding strength, fracture surface
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Abstract
The effect of adding porous Cu interlayer in lead-free solder on mechanical properties and microstructural were investigated. The soldering process were conduct in three different time at 267 degree.
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© 2013 by Japan Welding Society
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