Preprints of the National Meeting of JWS
Preprints of the National Meeting of JWS
Session ID : 205
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Host: Japan Welding Society

Formation of Intermetallic compounds and tensile strength on the Bond Interface of Aluminum-Clad Copper
*wei xie, tomiko yamaguchi, kazumasa nishio
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Keywords: aluminum-clad copper, vacuum roll bonding, intermetallic compounds, bond tensile strength
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[in Japanese]
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© 2011 by Japan Welding Society
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