From the viewpoints of grain refinement and preferred orientation, a mechanical alloying (MA) and hot-extrusion technique has been proposed to fabricate Bi₂Te₃-based bulk materials. In this paper, the MA and hot-extrusion process, microstructure and texture, thermoelectric and mechanical properties of extruded samples, and the effect of Cu-doping in n-type samples have been reviewed. The extruded samples exhibited fine-grained microstructure, and their basal planes were predominantly oriented parallel to the extrusion direction. The p-type Bi_0.4Sb_1.6Te₃ samples showed significant enhancements in both thermoelectric and mechanical properties. For example, the sample extruded at 400°C had a maximum value of ZT = 1.2 at room temperature and a much higher hardness than unidirectionally solidified samples. However, the n-type Bi₂Te_2.85Se_0.15 samples showed lower thermoelectric properties due to their higher carrier concentrations and smaller fractions of twin boundaries. Cu-doping in n-type samples resulted in a reduction in carrier concentration, and thus increases in related Seebeck coefficient and electrical resistivity and decrease in carrier thermal conductivity. The resulting ZT value of 0.86 for Cu_0.05Bi₂Te_2.85Se_0.15 sample was obtained.