Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / Challenges and Future Perspective for 3D and 2.5D Packaging
Semiconductor Packaging Technology for 3D Assembly
Tomoko Takahashi, Akio Katsumata
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2014 Volume 17 Issue 3 Pages 169-174

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