TEION KOGAKU (Journal of Cryogenics and Superconductivity Society of Japan)
Online ISSN : 1880-0408
Print ISSN : 0389-2441
ISSN-L : 0389-2441
Stabilization Effects of Cu-ion Plating on Nb3Al Multifilamentary Wire Made Using the RHQT Process
Akihiro KIKUCHIYasuo IIJIMAMasao FUKUTOMIKiyoshi INOUE
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1999 Volume 34 Issue 10 Pages 515-523

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Abstract
Nb3Al multifilamentary wire made by a rapid heating, quenching and transforming (RHQT) process shows not only 3-5 times higher Jc (4.2K), but also much lower strain sensitivity of superconductivity than that of commercialized (Nb, Ti)3Sn multifilamentary wire, and is therefore one of the most promising candidates as a next-generation superconductor. However, the Cu stabilization process is an unsolved key technology required to commercialize the RHQT-processed Nb3Al conductor. Because the RHQT process includes heat treatment at about 2, 000°C, which is much higher than the melting point of pure Cu, we must cover the Nb3Al wire with a Cu stabilizer after quenching. A stable Nb oxide layer is formed on the surface of the Nb3Al wire and prevents electrical and thermal conductivities between the Cu stabilizer and Nb3Al wire. We found that a 1μm thick Cu-ion plating on the Nb3Al wire removes the Nb oxide layer effectively. The Nb3Al wire, Cu-plated electrically with several tens of micrometers in thickness after being Cu-ion plated, shows improved Jc in lower fields and an increase in recovery current, which indicates the improved stability of the Nb3Al wire.
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© Cryogenic Association of Japan
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