TEION KOGAKU (Journal of Cryogenics and Superconductivity Society of Japan)
Online ISSN : 1880-0408
Print ISSN : 0389-2441
ISSN-L : 0389-2441
The Influence of Solder-filling on the ac Losses of Pulsed Superconducting Cables and Its Improvement
Hiroshi TATEISHIToshitada ONISHIKazuo KOMUROKenichi KOYAMA
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JOURNAL FREE ACCESS

1982 Volume 17 Issue 1 Pages 10-22

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Abstract
Ac losses of various kinds of pulsed conductors are measured. First, we found that the ac loss of the braid with Pb-40%Sn solder was extremely greater than that of the one without filler. Since the braid has the so-called three component strand, the intra-strand coupling loss will be quite small. Therefore, we concluded that the large increase of ac loss due to solder-filling was caused by the interstrand coupling through the outer copper sheath. To verify this, we measured the ac losses of the Cu-clad sample and the CuNi-clad one. Two samples have the same size and characteristics except that the one has copper outer sheath, the other does cupro-nickel one. With replacing Cu sheath by CuNi, the ac loss was decreased to the level of about one tenth of that of the Cu sheath strand. We also measured the ac losses of the compacted cables with and without Sn-5%Ag filler. Again, solder-filling caused a lot of increase in ac loss.
Our conclusion is as follows: Even three component strands cause large interstrand coupling through the outer copper sheath if they are solder-filled. To avoid this, copper sheath should be replaced by cupro-nickel. When cables are not solder-filled, contact resistance among strands cuts the interstrand coupling effectively.
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© Cryogenic Association of Japan
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