薄型AEセンサを用いたAlワイヤボンディング中の弾性波検出

石田 秀一; 田原 竜夫; 秋山 守人; 久保 智代; 宮崎 力

doi:10.1541/ieejias.134.840

Letter

Detection of Elastic Wave during Al Wire Bonding by Thin AE Sensor

Shuichi Ishida, Tatsuo Tabaru, Morito Akiyama, Chiyo Kubo, Chikara Miyazaki

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Keywords: acoustic emission sensor, Al wire bonding, elastic wave, anomaly detection

JOURNAL FREE ACCESS

2014 Volume 134 Issue 9 Pages 840-841

DOI https://doi.org/10.1541/ieejias.134.840

Details

Abstract

Elastic wave detection during Al wire bonding is demonstrated. The elastic waves emitted during the bonding process contain significant information on ultrasonic vibration, pressing load, processing time, bond power, etc. As a first step to obtaining useful information, a thin AE sensor was installed on a bonder for mass production. The sensor successfully detected the signals corresponding to the 1-cycle wire bonding. The result of the continuous wavelet transform analysis is also presented.

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