Silicone gel is widely used to encapsulate power modules, and improvement of its dielectric strength has been required. So, the purpose of our research is to improve dielectric strength of silicone gel encapsulant, and we focus on crosslinking degree of silicone gel. Previous studies have shown that growth mechanism of electrical tree changes with crosslinking degree of silicone gel. This suggests the possibility that the presence of the interface by different crosslinking degrees inhibits the tree growth. In this paper, we have investigated the tree growth and breakdown characteristics in silicone gel - crosslinking degrees graded layer materials. The interfaces in our study are arrange as being vertical to the line of electric force. Consequently, it was clarified that barrier effect of interface by different crosslinking degrees and the relaxation of electric field in low crosslinking degree region retards on tree growth, which improves the dielectric strength.